How to Work With an HDI PCB Manufacturer

hdi pcb manufacturer

How to Work With an HDI PCB Manufacturer

HDI PCBs require specialized fabrication equipment, laser drills and LDI (laser direct imaging) capabilities. They also feature thinner lines and tight component spacing. The technology is being driven by consumer demand for smaller, more capable products.

The main advantage of HDI circuit boards is that they can be fabricated with higher layer counts. It also helps reduce signal loss and improves the transfer of heat.


The lamination process is a critical step in the manufacturing of HDI PCBs. It provides a thin layer of protection over the printed circuit board, enhancing the ink colors and protecting it from damage. The thickness of the laminate varies, depending on the type of project. It can be glossy or matte, with glossy being the more popular choice. The laminate can also be a variety of different colors, including green, blue, red, white and black. Lamination jobs are priced based on the type of laminate used, the number of sheets and the amount of time it takes to complete the job. Glossy lamination is typically less expensive than matte.

The manufacturing process of a HDI PCB is very similar to that of ordinary multilayer PCBs, but with several differences. For example, the production of HDI boards requires a significant number of laser drills and buried or blind vias. Depending on the design of the board, this can increase the manufacturing cost.

The first step in manufacturing an HDI circuit board is to laminate the core and then mechanically drill it. Then, the manufacturer will plate the mechanical drill and use laser technology to drill further into the hole, forming a microvia. There are several varieties of HDI stack-ups, including a single layer with buried or blind vias and a multiple-layer version that includes microvias.


Drilling is one of the most crucial processes in PCB manufacturing. During this process, holes are drilled through the layers of the PCB to connect circuit elements. The size, location, and type of vias must be carefully selected to ensure optimal performance. The routing widths, traces, and via hdi pcb manufacturer types also have a significant impact on signal propagation. These factors should be taken into account when designing a board to avoid any problems in the final product.

To manufacture HDI PCBs, manufacturers use laser drilling technology and sequential lamination cycles. This process requires specialized equipment and special clean rooms. The resulting boards are more reliable than traditional PCBs. They are used in a variety of applications, including consumer electronics and medical devices.

Unlike traditional PCBs, HDI boards have blind or buried vias, which are used to conduct signal and power. These vias are drilled through the inner layers and filled with copper or another heat-conducting material. This allows designers to create more complex interconnections and reduces the overall thickness of the finished board.

In order to create these buried vias, manufacturers must use a different type of drilling technology. ESI’s new GeodeTM microvia drilling system uses a quasi-continous wave laser and AOD technology to achieve better tolerances than mechanical drilling. Its precise control over the beam intensity, heat, and duration eliminates damage to the drill bit and materials. It can also achieve higher aspect ratios than mechanical drilling.

Micro Vias

Modern technology trends towards smaller, lighter devices – such as smart phones and hand-held computers – drive demand for high density circuit boards. To accommodate these demands, designers must incorporate microvias to properly unfurl internal traces across the various layers of a circuit board.

Microvias – also known as blind vias – are a critical component of high-density PCBs, and can be designed in a variety of ways. Some common microvia styles include dog bone, staggered and through-hole. Dog bone vias have a straight path from the top to bottom of the circuit board, while through-hole microvias allow routing to occur between two layers.

A key factor in the design of microvias is their aspect ratio, which ideally should be less than 1. This ensures that they can be mechanically drilled and that they will not experience stress-induced failure in the future. Aspect ratios greater than this will cause a number of problems, including ICDs (interconnect defects) and brittle copper plating that can be difficult to detect during reflow.

Smaller aspect ratios also improve signal transmission quality, as they reduce impedance and crossing delays. In addition, microvias expose less copper to environmental conditions that can cause corrosion. The result is better durability and a HDI PCB Manufacturer Supplier longer life span for your circuit boards. This translates into lower production costs and shorter lead times.


HDI PCBs allow designers to use smaller components and save space. They also have better performance than traditional PCBs. They are ideal for high-speed circuits in mobile phones, tablet computers, and game consoles. They are also used in medical devices like pacemakers, which need to transmit fast signals and fit within a small package.

The main difference between a regular PCB and an HDI PCB is the size of the holes. HDI boards have smaller vias, which allows them to be drilled more easily. They also feature buried vias, which are holes that connect the inner layers of the board without going through the top and bottom layers.

Plating is another process that goes into producing an HDI PCB. The copper on a blind hole is thicker than on a normal PCB, which requires a more complex point plating process. This process takes longer and can increase the cost of a PCB.

Despite the increased manufacturing processes required for HDI, they can still be made at an affordable price. The key is to plan your orders and order enough stock so that you don’t have to rush orders. In addition, choosing a supplier with quick turnaround times can help reduce costs. This helps ensure that your PCBs are delivered on time and in good condition. Lastly, making sure that your design is streamlined can help you achieve your desired cost-effectiveness.

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